As we prepare for the imminent launch of the AMD Ryzen 7 9800X3D, a new leaked image of the upcoming gaming processor shows it stripped of its heatsink, exposing the silicon chips underneath. This AMD Ryzen 7 9800X3D The delid image in turn hints at a key reason why this processor should run at higher clock speeds than previous X3D models.

With the AMD Ryzen 7 9800X3D already expected as the best gaming processor When it launches, there are several reasons why there is so much anticipation, including the fact that it is based on AMD’s latest 9000 series architecture and includes an additional stack of L3 cache . However, it could be a new arrangement of its V-Cache 3D that pushes it into truly chart-topping territory.

The CPU removed picture comes via WCCFTech, which does not cite a source for the image; it simply indicates that the site obtained it. Anyway, what this shows is the familiar layout of recent AMD processors, where in the center of the substrate is a single larger silicon die, which is the processor’s I/O die, and then on the Next to it is another silicon chip and space for a second chip. . This last chip and space is where two complex die (CCD) can be installed, these silicon chips containing the processor cores.

Since the AMD Ryzen 7 9800X3D is expected to be an eight-core chip and each CCD in recent AMD processors includes eight cores, that’s why we only see one CCD in this image of the removed 9800X3D. In previous X3D chips, the chip containing the 3D V-cache was placed on top of this chip.

What’s interesting, however, is that if we look a little closer at the surface of this single CCD (bottom left), it appears uniform. This contrasts with previous X3D chips (bottom right) where we could see clear lines on the surface of the chip that delineate the 3D V-Cache chip and the small pieces of filler silicon used to support the cache. die.

This suggests three possibilities. Either the new cache chip is larger than before and fills the entire top surface of the CCD it sits on, or a new manufacturing method has made the previously visible filler material no longer visible, or AMD has flipped the chip, putting the cache chip below and the CCD on top. It is the latter option that seems the most likely, for several reasons.

Previous leaks on the AMD Ryzen 7 9800X3D Box Cover And AMD Ryzen 7 9800X3D review performance, hinted at the chip featuring “2nd generation 3D V-Cache technology” and “next generation 3D V-Cache technology”. These leaks also refer to the new design of the cover providing “better thermal performance” than before.

Since it is the CCD cores that give off the most heat, if they are now placed on top of the 3D V-Cache chip, this would potentially cool them more efficiently, thus enabling the higher clock speeds. fast ones that we have. I’ve also seen rumors coming with this chip. Specifically, while the 7800X3D peaks at 5GHz, the 9800X3D is expected to peak at 5.2GHz. It’s not a big step forward, but a win is a win.

This is all still speculation, with no official announcement from AMD. Indeed, the only official mention of the company itself to date is a confirmation AMD Ryzen 9000X3D release dateNovember 7 being reserved for a launch. It is assumed that the 9800X3D will be the only chip launched on this date, but again, this is not confirmed.

While we wait to see exactly what this date has in store for us, you can find out the best way to keep your possible new 9000X3D chip cool by taking a look at our best cpu cooler guide.